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Thermosonic Flip Chip Bonding - Finetech GmbH & Co. KG
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Thermosonic Flip Chip Bonding - Finetech GmbH & Co. KG
Website URL:
http://www.finetechusa.com/bonders/applications/thermosonic-flip-chip-bonding.html
Category:
Logistics Services
A major advantage of thermosonic flip chip bonding is the low temperature and low force required compared with other flip chip assembly methods.
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